(footprint "QFN50P400X400X100-25T250N"
	(version 20240108)
	(generator "pcbnew")
	(generator_version "8.0")
	(layer "F.Cu")
	(descr "24-QFN, 0.50 mm pitch, 4.00 X 4.00 X 1.00 mm body, 2.50 X 2.50 mm thermal pad\n\n24-pin QFN package with 0.50 mm pitch with body size 4.00 X 4.00 X 1.00 mm and thermal pad size 2.50 X 2.50 mm")
	(property "Reference" "REF**"
		(at 0 -2.9996 0)
		(unlocked yes)
		(layer "F.SilkS")
		(uuid "8ce70e66-abcd-4202-9e80-640d6526da2b")
		(effects
			(font
				(size 1.1684 1.1684)
				(thickness 0.1016)
			)
			(justify bottom)
		)
	)
	(property "Value" "QFN50P400X400X100-25T250N"
		(at 0 2.9996 0)
		(unlocked yes)
		(layer "F.Fab")
		(uuid "dd1660ae-37e5-49fe-81a1-79d4df00dba3")
		(effects
			(font
				(size 1.1684 1.1684)
				(thickness 0.1016)
			)
			(justify top)
		)
	)
	(property "Footprint" ""
		(at 0 0 0)
		(unlocked yes)
		(layer "F.Fab")
		(hide yes)
		(uuid "246c3e05-019b-4fbd-9852-02f4acd8953b")
		(effects
			(font
				(size 1.27 1.27)
			)
		)
	)
	(property "Datasheet" ""
		(at 0 0 0)
		(unlocked yes)
		(layer "F.Fab")
		(hide yes)
		(uuid "e5ef981d-4e28-4d5f-9b26-c6a2d230aee4")
		(effects
			(font
				(size 1.27 1.27)
			)
		)
	)
	(property "Description" ""
		(at 0 0 0)
		(unlocked yes)
		(layer "F.Fab")
		(hide yes)
		(uuid "14240fc8-640f-427f-9f91-774ffeb54b53")
		(effects
			(font
				(size 1.27 1.27)
			)
		)
	)
	(fp_line
		(start -2.05 -2.05)
		(end -1.636 -2.05)
		(stroke
			(width 0.12)
			(type solid)
		)
		(layer "F.SilkS")
		(uuid "26d41fd4-6311-4cd4-bda1-f9a46d1dddbe")
	)
	(fp_line
		(start -2.05 -1.636)
		(end -2.05 -2.05)
		(stroke
			(width 0.12)
			(type solid)
		)
		(layer "F.SilkS")
		(uuid "8cb20fa1-9d43-402c-b63f-4f770ef52508")
	)
	(fp_line
		(start -2.05 1.636)
		(end -2.05 2.05)
		(stroke
			(width 0.12)
			(type solid)
		)
		(layer "F.SilkS")
		(uuid "34d4828f-d841-45bf-8829-94d35258caa6")
	)
	(fp_line
		(start -2.05 2.05)
		(end -1.636 2.05)
		(stroke
			(width 0.12)
			(type solid)
		)
		(layer "F.SilkS")
		(uuid "8bc9e447-84b6-4d2b-9b40-1257d3531e3d")
	)
	(fp_line
		(start 2.05 -2.05)
		(end 1.636 -2.05)
		(stroke
			(width 0.12)
			(type solid)
		)
		(layer "F.SilkS")
		(uuid "4bb2ab47-4279-481c-a597-deb27e963a81")
	)
	(fp_line
		(start 2.05 -1.636)
		(end 2.05 -2.05)
		(stroke
			(width 0.12)
			(type solid)
		)
		(layer "F.SilkS")
		(uuid "2cca876e-cf99-40f0-a6c7-c0b0fad1443c")
	)
	(fp_line
		(start 2.05 1.636)
		(end 2.05 2.05)
		(stroke
			(width 0.12)
			(type solid)
		)
		(layer "F.SilkS")
		(uuid "5791a45f-dba2-4d04-a190-3257cee8f835")
	)
	(fp_line
		(start 2.05 2.05)
		(end 1.636 2.05)
		(stroke
			(width 0.12)
			(type solid)
		)
		(layer "F.SilkS")
		(uuid "da3f9e4e-53a1-41da-812d-0527a93d15da")
	)
	(fp_circle
		(center -2.554 -1.886)
		(end -2.429 -1.886)
		(stroke
			(width 0.25)
			(type solid)
		)
		(fill solid)
		(layer "F.SilkS")
		(uuid "f9862f1d-3c6d-40b0-b8c9-fe7b0b27a647")
	)
	(fp_line
		(start -2.05 -2.05)
		(end 2.05 -2.05)
		(stroke
			(width 0.12)
			(type solid)
		)
		(layer "F.Fab")
		(uuid "4ae2e174-2aba-4be3-b0b4-4210501f20d1")
	)
	(fp_line
		(start -2.05 2.05)
		(end -2.05 -2.05)
		(stroke
			(width 0.12)
			(type solid)
		)
		(layer "F.Fab")
		(uuid "f2730fe6-d14b-40a6-b067-bef9f70644be")
	)
	(fp_line
		(start 2.05 -2.05)
		(end 2.05 2.05)
		(stroke
			(width 0.12)
			(type solid)
		)
		(layer "F.Fab")
		(uuid "08dc6237-81ad-4c0f-9c46-ae597746def7")
	)
	(fp_line
		(start 2.05 2.05)
		(end -2.05 2.05)
		(stroke
			(width 0.12)
			(type solid)
		)
		(layer "F.Fab")
		(uuid "25a7b4ad-b84b-42a6-8d27-46052b7d239a")
	)
	(pad "1" smd roundrect
		(at -1.9346 -1.25)
		(size 0.86 0.264)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.5)
		(solder_mask_margin 0.1016)
		(thermal_bridge_angle 0)
		(uuid "dfea1b1b-3e55-4211-bb62-57eec55d5c72")
	)
	(pad "2" smd roundrect
		(at -1.9346 -0.75)
		(size 0.86 0.264)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.5)
		(solder_mask_margin 0.1016)
		(thermal_bridge_angle 0)
		(uuid "1b1dab5b-cd15-47a6-8603-afa09465ca6b")
	)
	(pad "3" smd roundrect
		(at -1.9346 -0.25)
		(size 0.86 0.264)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.5)
		(solder_mask_margin 0.1016)
		(thermal_bridge_angle 0)
		(uuid "7f52f54c-07b8-4bcf-9d7e-73e19bc3e10c")
	)
	(pad "4" smd roundrect
		(at -1.9346 0.25)
		(size 0.86 0.264)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.5)
		(solder_mask_margin 0.1016)
		(thermal_bridge_angle 0)
		(uuid "7a91fc9a-d428-4ecb-b46c-ad5482a9955c")
	)
	(pad "5" smd roundrect
		(at -1.9346 0.75)
		(size 0.86 0.264)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.5)
		(solder_mask_margin 0.1016)
		(thermal_bridge_angle 0)
		(uuid "c25b9c27-e311-4242-a796-821f38d48644")
	)
	(pad "6" smd roundrect
		(at -1.9346 1.25)
		(size 0.86 0.264)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.5)
		(solder_mask_margin 0.1016)
		(thermal_bridge_angle 0)
		(uuid "1c70677e-1e13-4a37-94e3-fcef0b969b9d")
	)
	(pad "7" smd roundrect
		(at -1.25 1.9346 90)
		(size 0.86 0.264)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.5)
		(solder_mask_margin 0.1016)
		(thermal_bridge_angle 0)
		(uuid "dec64be8-4a4e-49f4-8a76-dd836a25636f")
	)
	(pad "8" smd roundrect
		(at -0.75 1.9346 90)
		(size 0.86 0.264)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.5)
		(solder_mask_margin 0.1016)
		(thermal_bridge_angle 0)
		(uuid "7d56e32d-ac8f-4936-afec-1c0db4aa2c1e")
	)
	(pad "9" smd roundrect
		(at -0.25 1.9346 90)
		(size 0.86 0.264)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.5)
		(solder_mask_margin 0.1016)
		(thermal_bridge_angle 0)
		(uuid "c8af3f18-2d9f-4cc8-9a69-fd2d1af61598")
	)
	(pad "10" smd roundrect
		(at 0.25 1.9346 90)
		(size 0.86 0.264)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.5)
		(solder_mask_margin 0.1016)
		(thermal_bridge_angle 0)
		(uuid "0280ad35-66b6-429c-89b7-905b2c8a3bc6")
	)
	(pad "11" smd roundrect
		(at 0.75 1.9346 90)
		(size 0.86 0.264)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.5)
		(solder_mask_margin 0.1016)
		(thermal_bridge_angle 0)
		(uuid "db26b049-b46d-461e-9fe7-4ade066d22dd")
	)
	(pad "12" smd roundrect
		(at 1.25 1.9346 90)
		(size 0.86 0.264)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.5)
		(solder_mask_margin 0.1016)
		(thermal_bridge_angle 0)
		(uuid "e7c973ce-579a-4ef1-90c1-65d4e2e1c468")
	)
	(pad "13" smd roundrect
		(at 1.9346 1.25)
		(size 0.86 0.264)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.5)
		(solder_mask_margin 0.1016)
		(thermal_bridge_angle 0)
		(uuid "b82b71a2-ac89-489f-b5a7-7027ac01606d")
	)
	(pad "14" smd roundrect
		(at 1.9346 0.75)
		(size 0.86 0.264)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.5)
		(solder_mask_margin 0.1016)
		(thermal_bridge_angle 0)
		(uuid "5e8d179c-a179-4367-8628-7bf4f96c929a")
	)
	(pad "15" smd roundrect
		(at 1.9346 0.25)
		(size 0.86 0.264)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.5)
		(solder_mask_margin 0.1016)
		(thermal_bridge_angle 0)
		(uuid "15d8250f-42e4-4413-a208-b0d0c7ece107")
	)
	(pad "16" smd roundrect
		(at 1.9346 -0.25)
		(size 0.86 0.264)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.5)
		(solder_mask_margin 0.1016)
		(thermal_bridge_angle 0)
		(uuid "a83f0058-6e53-4091-8f95-13af39283bbf")
	)
	(pad "17" smd roundrect
		(at 1.9346 -0.75)
		(size 0.86 0.264)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.5)
		(solder_mask_margin 0.1016)
		(thermal_bridge_angle 0)
		(uuid "b4bbdf9e-0b24-456a-bc46-d58f974d9312")
	)
	(pad "18" smd roundrect
		(at 1.9346 -1.25)
		(size 0.86 0.264)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.5)
		(solder_mask_margin 0.1016)
		(thermal_bridge_angle 0)
		(uuid "17d15d8c-1107-4f20-a873-39a77c8d7652")
	)
	(pad "19" smd roundrect
		(at 1.25 -1.9346 90)
		(size 0.86 0.264)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.5)
		(solder_mask_margin 0.1016)
		(thermal_bridge_angle 0)
		(uuid "8f9e374d-e770-4cf3-9a1c-e87d4aa57c72")
	)
	(pad "20" smd roundrect
		(at 0.75 -1.9346 90)
		(size 0.86 0.264)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.5)
		(solder_mask_margin 0.1016)
		(thermal_bridge_angle 0)
		(uuid "a23aa4a1-a8b8-4479-a7c3-b4a8b4c617d7")
	)
	(pad "21" smd roundrect
		(at 0.25 -1.9346 90)
		(size 0.86 0.264)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.5)
		(solder_mask_margin 0.1016)
		(thermal_bridge_angle 0)
		(uuid "5e3e0cfa-542d-4e14-a8bb-22ba0d3405f8")
	)
	(pad "22" smd roundrect
		(at -0.25 -1.9346 90)
		(size 0.86 0.264)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.5)
		(solder_mask_margin 0.1016)
		(thermal_bridge_angle 0)
		(uuid "c3041f6c-78cf-4638-94e7-f32e5e20db58")
	)
	(pad "23" smd roundrect
		(at -0.75 -1.9346 90)
		(size 0.86 0.264)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.5)
		(solder_mask_margin 0.1016)
		(thermal_bridge_angle 0)
		(uuid "5eea7753-fdc9-46e8-b70c-e439b5fa289f")
	)
	(pad "24" smd roundrect
		(at -1.25 -1.9346 90)
		(size 0.86 0.264)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.5)
		(solder_mask_margin 0.1016)
		(thermal_bridge_angle 0)
		(uuid "95e14e3b-b900-4de7-ac39-3530454ce8cf")
	)
	(pad "25" smd rect
		(at 0 0)
		(size 2.5 2.5)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(solder_mask_margin 0.1016)
		(zone_connect 2)
		(thermal_bridge_angle 0)
		(uuid "20e5eefe-cf72-439e-8d8c-24ca368e1422")
	)
)